Thin Film Products

Features

  • Process provides deposition of integrated circuits on various substrates for film capacitors, film inductors, film resistors and other applications

  • Wide range of components with high precision

  • Excellent temperature and frequency characteristics at millimeter wave band
    • THIN-FILM
    Substrate Parameters
    Substrate Material Codes
      Alumina Aluminum Nitride Beryllium Oxide
    Dielectric Code A N B
    Purity 99.6% 98.0% 99.5%
    Density 3.87 g/cm3 3.28 g/cm3 2.85 g/cm3
    CTE 6.3 ppm/° @ 20-300°C 4.6 ppm/° @ 20-300°C 9.0 ppm/° @ 20-300°C
    TC 26.9 W/m°K 170 W/m°K 270 W/m°K
    K 9.8 @25°C,1MHz 8.6 @25°C,1MHz 6.5 @25°C,1MHz
    DF 0.0001 @ 1MHz 0.001 @ 1MHz 0.0004 @ 1MHz
    Q 5000 @ 1GHz 5000 @ 1GHz ——
    Grain Size <1.0µm 5 – 7µm 9 –16µm
    Substrate Thickness Code Inch (mm)
    T Code 1 2 3 4 5
    Thickness 0.010±0.002
    (0.254±0.051)    		 0.015±0.002
    (0.381±0.051)
    		 0.020±0.002
    (0.508±0.051)    		 0.025±0.002
    (0.625±0.051)    		 Other